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| ! " !"#$# # % # #&' !" # # $ #! %"" &" ' ($ # $ #) &" * $ +,! - - + . - /, + 01 $ 2 ' "34 ! 1 , +% 5 !6 #7& &" / 2 ' "34 ! 1 , +% 5 $ !6 # 7 " 8 / 9 6 $ 01 $ 2 0 "34 ! 1 , :% , & 6 , $ #)7 " / $ ;$ # 2 & ! & ! #)7 " < / ! = -! # ! ! / & $ " 6- $ #;$ #'+ + ;$ " : > : $ # !" # 01 - - 0 2 0 7?"/ 9$! !$ + * && - +,! $ 2 + - + 7- + 9$! !$ + * & / +,! +, # 2 0 7&/ 2 + 7&/ + * " ! ) ($ ! 5 !6 * &" # +!! ) )$ 5 $ !6 * " @5 ) )$ a 5 $ !6 * 8 00.511.52 0.1 1 10 20 5 0.2 0.5 LN15XB60 tc=150c[typ] tc= 25c[typ] 2 50 forward voltage pulse measurement per diode forward voltage i f [a] forward current v f [v] 0 5 10 15 20 25 30 35 40 0246810121416 sin LN15XB60 forward power dissipation i o [a] average rectified forward current tj = 150c p f [w] forward power dissipation 0 50 100 150 200 250 300 1 10 100 LN15XB60 [cycle] number of cycles i fsm [a] peak surge forward current peak surge forward capability i fsm 10ms 10ms 1 cycle non-repetitive, sine wave, tj=25c before surge current is applied 0 20 40 60 80 100 120 140 160 0 0.5 1 1.5 2 2.5 3 3.5 4 sin LN15XB60 v r = v rm derating curve ta [c] ambient temperature i o [a] average rectified forward current pcb glass-epoxy substrate soldering land 5mm phi 0 20 40 60 80 100 120 140 160 0 5 10 15 20 25 sin LN15XB60 v r = v rm tc tc heatsink . i o [a] tc [c] case temperature average rectified forward current derating curve |
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